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[2] Wei, S., Wang, W., Zhou, L., Guo, J. Improving the Heat Conduction and Mechanical Properties of Thermal Interface Materials by Constructing Diphase Continuous Structure Reinforced by Liquid Metal. Composites Part A 2022, 162, 107149.
[3] Xingmin Li, Jian Wang, Hongbo Qin, Siliang He, Wangyun Li, Song Wei*. Creep performance of phase-inhomogeneous Cu/Sn–58Bi/Cu solder joints with increasing current density. Journal of Materials Science: Materials in Electronics, 2022, 33, 16167–16182.
[4] 周丽君, 位松, 郭敬东, 孙方远, 王新伟, 唐大伟. 基于飞秒激光时域热反射法的微尺度 Cu-Sn 金属间化合物热导率研究 [J]. 金属学报, 2022, 58(12), 1645-1654. (共一)
[5] S. Wei, Z.F. Yu, L.J. Zhou, J.D. Guo. Investigation on enhancing the thermal conductance of gallium-based thermal interface material using Cr-coated diamond particles. Journal of Materials Science: Materials in Electronics, 30 (2019): 7194-7202.
[6] Z.F. Yu, S. Wei, J.D. Guo. Fabrication of aligned carbon-fiber/polymer TIMs using electrostatic flocking method. Journal of Materials Science: Materials in Electronics, 30 (2019): 10233-10243.
[7] S. Wei, H.C. Ma, J.Q. Chen, J.D. Guo. Extreme anisotropy of electromigration: Nickel in single-crystal tin. Journal of Alloys and Compounds, 687 (2016): 999-1003.
[8] Yun, M., Zhang, K., Cai, M., Yang, Y., Feng, C., Wei, S.*, Zhang, G. Extraction, Optimization and Failure Detection Application of Parasitic Inductance for High-Frequency SiC Power Devices. The 22nd International Conference on Electronic Packaging Technology (ICEPT), 2021, 1-5.
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[10] L.M. Yin, S. Wei, Z.L. Xu. The effect of joint size on the creep properties of microscale lead-free solder joints at elevated temperatures. Journal of Materials Science: Materials in Electronics, 24 (2013): 1369-1374.
