[1] Jiaqiang Huang, Yunhui Zhu, Kunhong Pan, Xudong Wang, Zhaoling Huang, Dawei Xiao, Hongjie Jiang, Polarity effect of interfacial intermetallic compounds of BGA structure Cu/Sn-52In/Cu solder joints during electromigration, Intermetallics, 2024, 168: 108252. (SCI)
[2] Jiaqiang Huang, Yunhui Zhu, Xudong Wang, Zhaoling Huang, Fengmei Liu, Yupeng Zhang, Melting Characteristic, Wettability, Interfacial Reaction and Shear Property of Ball Grid Array Structure Cu/Sn0.3Ag0.7Cu/Cu Solder Joints with Ni-Modified Carbon Nanotubes, IEEE Transactions on Components, Packaging and Manufacturing Technology, 2023, 13, 8: 1174-1186. (SCI)
[3] Zhaoling Huang, Siyuan Li, Hao Guo, Caiping Huang, Yuyu Bian, Yubing Gong, Jiaqiang Huang*, Qi Zeng*, Multi-scale GO/CNT/AlN nanocomposites for high-performance flexible electrothermal film heaters, Journal of Materials Chemistry C, 2023, 11, 9925-9936. (SCI)
[4] Wangyun Li*, Feng Chen, Jun Gui, Siliang He, Hongbo Qin, Jiaqiang Huang*, Enhanced size effects on shear performance and fracture behavior of BGA structure micro-scale Cu/Sn–3.0Ag–0.5Cu/Cu joints at low temperatures, Microelectronics Reliability, 2023, 150: 115093. (SCI)
[5] Shuibao Liang, Han Jiang, Jiaqiang Huang, Study on Phase Electromigration and Segregation Behavior of Cu-Cored Sn-58Bi Solder Interconnects under Electric Current Stressing, Journal of Electronic Materials, 2023, 53(3): 1192-1200. (SCI)
[6] Jiaqiang Huang, Xudong Wang, Junyu Chen, Weichun Wei, Fengmei Liu, Binhao Qin, Haiyan Wang, Yupeng Zhang, Growth mechanisms of intermetallic compounds and Bi-rich layer in ball grid array structure Cu/Sn-58Bi/Cu solder joints during solid-solid and liquid-solid electromigration, Journal of Materials Science: Materials in Electronics, 2022, 33:10297-10313. (SCI)
[7] Shuibao Liang, Changbo Ke, Jiaqiang Huang, Minbo Zhou, Xinping Zhang, Phase field simulation of microstructural evolution and thermomigration-induced phase segregation in Cu/Sn58Bi/Cu interconnects under isothermal aging and temperature gradient, Microelectronics Reliability, 2019, 92: 1-11. (SCI)
[8] Huang Jiaqiang, Zhou Minbo, Liang Shuibao, Zhang Xinping, Size effects on the interfacial reaction and microstructural evolution of Sn-ball/Sn3.0Ag0.5Cu-paste/Cu joints in board-level hybrid BGA interconnection at critical reflowing temperature, Journal of Materials Science: Materials in Electronics, 2018, 29(9): 7651-7660. (SCI)
[9] Jiaqiang Huang, Minbo Zhou, Xinping Zhang, The melting characteristics and interfacial reactions of Sn-ball/Sn–3.0Ag–0.5Cu-paste/Cu joints during reflow soldering, Journal of Electronic Materials, 2017, 46(3): 1504-1515. (SCI)
[10] Yunhui Zhu, Lifang Wang, Xudong Wang, Siliang He, Jiaqiang Huang*, Preparation and performance evaluation of Sn-Bi solder paste, The International Conference on Electronic Packaging Technology (ICEPT), 2022. (EI)
[11] Jiaqiang Huang, Minbo Zhou, Xinping Zhang, Effect of electromigration on the interfacial reaction and shear fracture behavior of mixed assembly Cu/Sn–3.0Ag–0.5Cu-ball/Sn–58Bi-paste/Cu joints in board-level packaging, The International Conference on Electronic Packaging Technology (ICEPT), 2018: 531-535. (EI)
[12] Jiaqiang Huang, Minbo Zhou, Xingfei Zhao, Xinping Zhang, Microstructures and shear properties of mixed assembly BGA structure SnAgCu/SnBi(Ag)/Cu joints in board-level packaging, The International Conference on Electronic Packaging Technology (ICEPT), 2017, 1649-1654. (EI)
[13] Jiaqiang Huang, Minbo Zhou, Wangyun Li, Xinping Zhang, Size effect on the interfacial reactions and microstructural evolution of Cu/Sn3.0Ag0.5Cu-balll/Sn3.0Ag0.5Cu-paste/Cu joints in flip-chip on BGA packaging, The International Conference on Electronic Packaging Technology (ICEPT), 2016, 1010-1014. (EI)
[14] Jiaqiang Huang, Minbo Zhou, Xinping Zhang, Interfacial reactions and microstructural evolution of BGA structure Cu/Sn3.0Ag0.5Cu/Sn58Bi/Cu mixed assembly joints during isothermal aging, The International Conference on Electronic Packaging Technology (ICEPT), 2016, 968-973. (EI)
[15] Jiaqiang Huang, Minbo Zhou, Wangyun Li, Xinping Zhang, Interfacial reactions and formation of inter metallic compound of Sn-ball/Sn–3.0Ag–0.5Cu-paste/Cu joints in flip-chip on BGA packaging, The International Conference on Electronic Packaging Technology (ICEPT), 2015, 307-311. (EI)
[16] Jiaqiang Huang, Minbo Zhou, Changzheng Li, Xiao Ma, Xinping Zhang, Processing Performance and Microstructure of Sn-Zn Based Solders Modified by Bi and Mixed Rare Earth Elements, The International Conference on Electronic Packaging Technology (ICEPT), 2012, 352-355. (EI)
