部分已发表论文
[1] Effects of near-amorphous multiphase intermetallic compound particles on the microstructure and mechanical properties of SnBi solders，Journal of Materials Science: Materials in Electronics, 2023, 34(15): 1248，通讯作者
[2]电-热-力耦合载荷下非均匀组织Cu/Sn-58Bi/Cu微焊点拉伸力学性能研究，《机械工程学报》，2022，58（2）：307-320，EI，本学科顶尖中文期刊，通讯作者
[3] Shear performance of Cu/Sn–3.0 Ag–0.5 Cu/Cu joints with same solder volume and different heights at increasing current density， Journal of Materials Science: Materials in Electronics, 2022, 33(32), 24906-24919，通讯作者
[4] Influence of microstructure evolution on the current density and temperature gradient of line-type Cu/Sn58Bi/Cu microscale solder joint under current stressing, Journal of Electronic Materials, 2022, 51: 1116-1127，通讯作者
[5] Influence of phase inhomogeneity on the mechanical behavior of microscale Cu/Sn–58Bi/Cu solder joints, Journal of Materials Science: Materials in Electronics, 2022, 33(1): 244-259，通讯作者
