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何思亮 中级 (siliang_he@guet.edu.cn)    

beat365体育亚洲入口    

先进微连接技术;键合可靠性;低成本烧结技术;

个人简介

何思亮,助理研究员,校聘副教授,博士(后),硕士生导师。2020年毕业于日本大阪大学接合科学研究所智能制造工程。现主要从事先进电子封装微连接技术,三维异构集成、低成本功率器件烧结技术研发,主持广西自然科学基金、中国博士后面上基金等科研项目。担任《Journal of Materials Science & Technology》、《Current Organic Chemistry》、《Welding in the World》等SCI期刊审稿人。在电子封装领域发表相关学术论文40余篇,SCI/EI收录30余篇,其中第一及通讯作者10余篇,论文被引200余次,在国内外高水平会议上做口头报告8次。研究室气氛融洽,经常聚餐。欢迎电子封装、机械、材料、电气相关同学报考,督促老师进步,引领老师成长。

教育背景
2015年04月-2020年03月:日本大阪大学   智能绿色工程                        博士
2013年10月-2015年03月:日本大阪大学   智能绿色工程                        硕士
2008年09月-2012年06月:重庆大学          机械设计制造及其自动化       学士
工作经历
2020年04月-2020年09月: 日本大阪大学         接合科学研究所      客座研究员

2019年11月-2020年02月: beat365体育亚洲入口   机电工程学院         助教

2020年03月-至今:            beat365体育亚洲入口   机电工程学院         专任教师

2021年04月-至今:            广东科学院             半导体研究所         博士后

主要荣誉

机电工程学院2021年度优秀员工

机电工程学院2021-2022学年优秀班主任

机电工程学院第一届青年教师讲课比赛一等奖

beat365体育亚洲入口第二届优秀研究生指导老师团队

学术活动

学会报告

•(特邀)第十六届中西南十省区(市)焊接学术会议,2022年9月16日,重庆

•(口头)中国机械工程学会焊接分会青年工作者研讨会,2021年4月16日-2021年4月18日,天津

•(Poster) The 5th International Symposium on Visualization in Joining & Welding Science through Advanced Measurements and Simulation (Visual-JW2019), 2019, Osaka, Japan
•(Poster) 2019 Taiwan-Japan Workshop on Electronic-Interconnection III, 2019, Taichung, Taiwan, China
•(Oral) International Conference on Electronic Packaging (ICEP-IAAC- IEEE), 2017, Tendo, Japan 
•(Oral) 23rd Symposium on “Micro-joining and Mounting Technology in Electronics”, 2017, Yokohama, Japan
•(Oral) The 4th international Symposium on visualization in Joining & Welding Science through Advanced Measurements and Simulation (Visual-JW2016), 2016, Osaka, Japan
•(Oral) The 26th Microelectronics Symposium, 2016, Nagoya, Japan
•(Oral) The National Meeting of Japan Welding Society in Spring,2016, Osaka, Japan
•(Oral) The National Meeting of Japan Welding Society in Autumn,2015,Hokkaido, Japan.

教学信息
大一专业课     《工程图学1》《工程图学2》
研究生课程     《材料科学与检测新技术》

主要论文
期刊论文
Siliang He#,*, Yu-An Shen#, Bifu Xiong, Fupeng Huo, Jiahui Li, Jinguo Ge, Zhiliang Pan, Wangyun Li, Chuan Hu, Hiroshi Nishikawa.Behavior of Sn-3.0Ag-0.5Cu Solder/Cu Fluxless Soldering via Sn Steaming under Formic Acid Atmosphere. Journal of Materials Research and Technology 21(3): 2352-2361(2022). (SCI, IF6.267)
•Gong, Y., Liu, L., He, S., Yan, H., Li, W.*, Qin, H.* Shear performance of Cu/Sn–3.0Ag–0.5Cu/Cu joints with same solder volume and different heights at increasing current density. J Mater Sci: Mater Electron (2022).  Online. (SCI, IF2.779)
•Minghui Yun, Daoguo Yang*, Siliang He*, Miao Cai, Jing Xiao, Kailin Zhang and Guo- Qi Zhang. Failure Quantitative Assessment Approach to MOSFET Power Device by Detecting Parasitic Parameters. Frontiers in Physics. Online. (SCI, IF3.778)
Xinmin Li, Jian Wang, Hongbo Qin, Siliang He, Wangyun Li*, and Song Wei*. Creep performance of phase-inhomogeneous Cu/Sn–58Bi/Cu solder joints with increasing current density. Journal of Materials Science: Materials in Electronics 33, 16167–16182 (2022) (SCI, IF2.779)
Siliang He*, Yuhao Bi, Yu-An Shen, Zhikuan Chen, Gao Yue*, Chuan Hu, and Hiroshi Nishikawa. Contact Angle Analysis and Intermetallic Compounds Formation Between Solders and Substrates under Formic acid Atmosphere. Journal of Advanced Joining Process. (2022), 6, 100118. (ESCI, citescore 2.1)
•Peijie Liang, Zhiliang Pan, Liang Tang, Guoqi Zhang, Daoguo Yang, Siliang He*, and Haidong Yan*. Molecular Dynamics Simulation of Sintering Densification of Multi-Scale Silver Layer. Materials.2022), 15, 2232. (SCI, IF3.748)
•Juncai Hou*; Qiumei Zhang; Siliang He; Jingru Bian; Jinting Jiu; Chengxin Li; Hiroshi Nishikawa., Large-area and low-cost Cu-Cu bonding with cold-spray-deposition, oxidation and reduction processes under low-temperature conditions. Journal of Materials Science: Materials in Electronics 32 (2021), pp.20461–20473 (SCI, IF2.779)
•Duy Le Han*, Yu-An Shen, Siliang He, Hiroshi Nishikawa., Effect of Cu addition on the microstructure and mechanical properties of In–Sn-based low-temperature alloy. Materials Science and Engineering: A 804 (2021), pp.140785(SCI, IF6.004)
•Fupeng Huo*, Yu-An Shen, Siliang He, Keke Zhang, Hiroshi Nishikawa., Fabrication of NiO/ZrO2 nanocomposites using ball milling-pyrolysis method. Vacuum 191 (2021), pp.110370(SCI, IF4.110)
He, S.*, Gao, R., Shen, Y-A., Li, J. and Nishikawa, H., Wettability, Interfacial reactions, and Impact Strength of Sn-3.0Ag-0.5Cu Solder/ENIG Substrate Used for Fluxless Soldering under Formic Acid Atmosphere. Journal of Materials Science 55 (7) (2020), pp.3107-3117 (SCI, IF4.682)
He, S.*, Gao, R., Li, J., Shen, Y-A. and Nishikawa, H., In-situ observation of fluxless soldering of Sn-3.0Ag-0.5Cu/Cu under a formic acid atmosphere. Materials chemistry and Physics 239 (2020)122309. (SCI, IF4.778)
•Gao, R.*, He, S., Li, J., Shen, Y-A. and Nishikawa, H., Interfacial transformation of preoxidized Cu microparticles in a formic-acid atmosphere for pressureless Cu–Cu bonding. Journal of Materials Science: Materials in Electronics 31 (2020), pp.14635–14644. (SCI, IF2.779)
•Gao, R.*, Shen, Y-A., Li, J., He, S. and Nishikawa, H., Interfacial transformation of preoxidized Cu microparticles in a formic-acid atmosphere for pressureless Cu–Cu bonding. Journal of Materials Science: Materials in Electronics 31 (2020),pp.21711-21722(SCI, IF2.779) 
•Zhou, S.*, He, S. and Nishikawa, H., Effect of Zn addition on interfacial reactions and mechanical properties between eutectic Sn58Bi solder and ENIG substrate. Journal of Nanoscience and Nanotechnology, 20 (1), (2020), pp.106-112. (SCI)
•Jin, Z.*, Shen, Y-A., He, S., Zhou, S., Chan, Y, C. and Nishikawa, H. Novel Polarity Effect on Intermetallic Compound Thickness Changes during Electromigration in Cu/Sn- 3.0Ag - 0.5Cu/Cu Solder Joints. Journal of Applied Physics 126, (2019), 185109. (SCI, IF2.877)
•Shen, Y-A.*, Lin, C.M., Li, J., He, S. and Nishikawa, H., 2019. Effect of FeCoNiCrCu 0.5 High-entropy-alloy Substrate on Sn Grain Size in Sn-3.0 Ag-0.5 Cu Solder. Scientific Reports 9(1) (2019), pp.3658. (SCI, IF4.996)
•Gao, R.*, He, S., Shen, Y-A and Nishikawa, H., Effect of Substrates on Fracture Mechanism and Process Optimization of Oxidation–Reduction Bonding with Copper Microparticles. Journal of Electronic Materials 48(4) (2019), pp.2263-2271. (SCI, IF2.047)
He, S. and Nishikawa, H.*, Effect of Thermal Aging on the Impact Strength of Soldered Bumps under Formic acid Atmosphere. Quarterly Journal of The Japan Welding Society 35 (2017), pp.127-131. (EI)
•Liu, X.*, He, S. and Nishikawa, H., Low temperature solid-state bonding using Sn-coated Cu particles for high temperature die attach. Journal of Alloys and Compounds 695 (2017), pp.2165-2172. (SCI, IF 6.371)
•Liu, X.*, He, S. and Nishikawa, H., Thermally stable Cu3Sn/Cu composite joint for high-temperature power device. Scripta Materialia, 110, (2016), pp.101-104. (SCI, IF 6.302)

会议论文

•Guoping Lv, Haidong Yan*, Siliang He* et al. Bonding Process of Copper Foam-Silver Composite and Performance Characterization of the Joint. In The International Conference on Electronic Packaging Technology (ICEPT), 2022(EI)
•Bifu Xiong, Huixiu Lu, Yuhao Bi, Jiaqiang Huang and Siliang He*. Shear strength of joint formed using Sn-58Bi/Cu porous structure via TLP bonding. In 2022 The 2nd International Conference on Mechanical Engineering, Intelligent Manufacturing and Automation Technology (MEMAT 2022), 2022(EI)
•Bi Yuhao, He Siliang*, Li Wangyun*, Shen Yu-An, Daoguo Yang and Hiroshi Nishikawa. Wettability improvement of solder in fluxless soldering under formic acid atmosphere. In The International Conference on Electronic Packaging Technology (ICEPT), 2021(EI)
•He, S., Gao, R., Li, J. and Nishikawa, H.*, Sn steaming phenomenon under formic acid atmosphere. In The 5th International Symposium on Visualization in Joining & Welding Science through Advanced Measurements and Simulation (Visual-JW2019), 2019
•He, S.* and Nishikawa, H., Effect of substrate metallization on the impact strength of Sn-Ag-Cu solder bumps fabricated in a formic acid atmosphere. In International Conference on Electronic Packaging (ICEP), 2017 (pp. 381-385). IEEE. (EI)
•Zhang, Y.*, He, S. and Nishikawa, H. Impact strength of Sn-Ag-Cu/Cu solder bumps formed by an induction heating method. In 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2017 (pp. 50-53). IEEE. (EI)
•Nishikawa, H.*, Liu, X. and He, S. Effect of bonding conditions on shear strength of joints at 200° C using Sn-coated Cu particle. In 2017 21st European Microelectronics and Packaging Conference (EMPC), 2017 (pp. 1-4). IEEE. (EI)
•He, S. and Nishikawa, H.*, Effect of Thermal Aging on the Impact Strength of Soldered Bumps under formic acid atmosphere. In The international Symposium on visualization in Joining & Welding Science through Advanced Measurements and Simulation (Visual-JW2016), 2016 (pp. 27-28).
•Liu, X.*, He, S. and Nishikawa, H. Low temperature bonding using microscale Cu particles coated with thin Sn layers at 200° C. In International Conference on Electronic Packaging (ICEP), 2016 (pp. 306-309). IEEE. (EI)
•He, S.* and Nishikawa, H., Formation of Solder Bumps on Electroless Ni/Au Plating Using Formic Acid Atmosphere.Proceeding of Micro-joining and Assembly Technology in Electronics Symposium, 2017.  (pp. 264-267)

何 思亮, 西川 宏, ギ酸雰囲気を用いた無電解Ni/Auめっき上へのはんだバンプ形成 . 第23回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集, 77-78
何 思亮, 西川 宏, リフローはんだ付におけるフラックスとギ酸雰囲気の比較. マイクロエレクトロニクスシンポジウム論文集 第 26 回マイクロエレクトロニクスシンポジウム, 107-110
何 思亮, 西川 宏,  ギ酸雰囲気を用いたはんだ付でのボイド形成に及ぼす加熱条件の影響. 溶接学会全国大会講演概要 平成 28 年度春季全国大会, 158-159
何 思亮, 西川 宏, 菊池 大地, 上島 稔, はんだ濡れ性および界面反応におけるギ酸雰囲気の影響. 溶接学会全国大会講演概要 平成 27 年度秋季全国大会, 418-419

学术著作
科研项目
1. 广西自然科学基金青年基金,甲酸气氛下焊料动态润湿行为及机理研究,8万元,2021年03月至2024年03月,主持
2. 广西创新基地与人才专项青年项目,面向三维(3D)封装的无助焊剂钎焊形成焊点可靠性与失效机理研究,10万元,2020年12月至2023年12月,主持
3. 中国博士后基金面上项目,8万元,2021年09月至2023年04月,主持
4. 广西制造系统与先进制造技术重点实验室主任课题,面向高密度封装的微连接技术,3万元,2021年03月至2023年03月,主持

5. 国家自然科学基金面上项目,纳米孪晶材料延展性本质及其失效破坏机理研究,61万元,2022年01月至2025年12月,参与(第2)

6. 广东省科学院半导体集成电路关键技术及其应用研究,2500万元,2022年01月至2026年12月,共同主持。

7. 广东省科学院半导体所面板级扇出封装项目子课题,40万元,主持。


知识产权
联系信息

邮箱:siliang_he@guet.edu.cn

电话:15608108983;17777347125

地址:beat365体育亚洲入口花江校区机电工程学院321-3

常用链接
Baidu
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