[1] Wang B, Li W Y, Zhang S Y, Li X M, Pan K L. Effect of electric current stressing on mechanical performance of solders and solder joints: A review. Journal of Materials Science, 2022, 57: 17533–17562. (JCR2区)
[2] Wang B, Li W Y, Pan K L. Shear performance of microscale ball grid array structure Sn‒3.0Ag‒0.5Cu solder joints with different surface finish combinations under electro‒thermo‒mechanical coupled loads. Journal of Materials Science: Materials in Electronics, 2022, 33(8): 4924–4939. (JCR2区)
[3] Wang B, Li W Y, Pan K L. Abnormal shear performance of microscale ball grid array structure Cu/Sn‒3.0Ag‒0.5Cu/Cu solder joints with increasing current density. Crystals, 2022, 12: 85. (JCR2区)
[4] Wang B, Pan K L, Gong Y B, Long Y H, Shi K. Effect of ultrasonic power on wettability, porosity and mechanical properties of ultrasonic‒aided laser reflow soldering. International Journal of Modern Physics B, 2021, 35: 2150063. (JCR2区)
[5] Wang B, Li W Y, Huang W, Gong Y B, Xu J, Pan K L. The breakdown of Anand constitutive model in life prediction of microscale BGA structure Sn–3.0Ag–0.5Cu joints stressed with electric current. In proceedings of 23th International Conference on Electronic Packaging Technology, 2022, pp. 1–6. (EI收录)
[6] Liu H L, Wang B(通讯), Qi Z W, Zhang G P, Wang D Z. Surface microstructure and anti‒wear of WC‒CoCr coatings cladded by electron beam. Rare Metal Materials and Engineering, 2018, 47: 3338‒3344. (JCR4区)
[7] Huang W, Pan K L, Wang B, Gong Y B. Grain size effects on mechanical properties of nanocrystalline Cu6Sn5 investigated using molecular dynamics simulation. Materials, 2022, 15: 3889. (JCR2区)
[8] Liu H L, Qi Z W, Wang B, Zhang G P, Wang X Y, Wang D Z. Numerical simulation of temperature field during electron beam cladding for NbSi2 on the surface of Inconel617. Materials Research Express, 2018, 5: 036528. (JCR3区)
[9] Liu H L, Huang Y P, Wang B, Wang X Y. Study on the process optimization and wear resistance of electron beam cladding WC‒CoCr coating on Inconel617 surface. Advance in Materials Science and Engineering, 2019, 10: 1‒10. (JCR 4区)
[10] Li Z, Yang Y Q, Wang B, Huang W, Gong Y B, Pan K L. Study on IMC growth law of solder joints in aerospace electronic products and its influence on reliability. The 2nd International Conference on Electronic Information and Mechanical Manufacturing (EIMM), 2022, PP. 1‒6. （EI收录）
[11] 王波，刘海浪，祁正伟，张国培，王小宇．电子束熔覆表面改性技术的研究进展[J]．热加工工艺，2018，47：19‒22．（中文核心）
[12] 刘海浪，王波，李行，黄以平．Inconel617合金表面电子束熔覆WC‒CoCr显微组织和耐磨性研究[J]．航空制造技术，2017，21：102‒104，109．（中文核心）
[13] 刘海浪，王小宇，王波，祁正伟，张国培．电子束加工应力场的研究现状与发展趋势[J]．热加工工艺，2019，48：21‒25．（中文核心）
[14] 黄以平，张国培，刘海浪，王波，蒋健博．Inconel617合金表面电子束熔覆NbMoCr显微组织和耐腐蚀性的探讨[J]．焊接学报，2019，40：101‒106．（EI）
