部分期刊论文 （*通讯作者）
近三年一作/通讯发表论文
1.Zhang Hongqiang, He Siliang*, Qu Guanda, Deng Zhongyang, Zou Guisheng, Jia Qiang*, Deng Erping*, Guo Wei, “Improved thermal conductivity and reliability through graphene reinforced nanopaste for power devices in new energy vehicles”, IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 14, no. 1, pp. 52-60, 2024（SCI, IF2.2 ）
2. Xiong Bifu, He Siliang*, Ge Jinguo, Li Quantong, Hu Chuan, Yan Haidong, Shen Yu-An*, “Cu-Cu joint with Sn-58Bi/Porous Cu/Sn-58Bi transient liquid phase bonding under formic acid atmosphere”, Soldering & Surface Mount Technology, Vol. 36 No. 1, pp. 39-50, 2024(SCI, IF2.1，中科院二区)
3. Li Wangyun*, Mo Lanqing, Li Xingmin, Wang Jian, Qin Hongbo, He Siliang*,“Minor Ag induced shear performance alternation in BGA structure Cu/SnBi/Cu solder joints under electric current stressing”,Journal of Materials Research and Technology, Vol. 25, pp. 6111-6122, 2023(SCI, IF6.4,中科院一区TOP)
4. He Siliang*, Shen Yu-An, Xiong Bifu, Huo Fupeng, Li Jiahui, Ge Jinguo, Pan Zhiliang, Li Wangyun, Hu Chuan, Nishikawa Hiroshi, “Behavior of Sn-3.0Ag-0.5Cusolder/Cu fluxless soldering via Sn steaming under formic acid atmosphere”,Journal of Materials Research and Technology, Vol. 21, pp. 2352-2361, 2022(SCI, IF6.4,中科院一区TOP)
5. He, Siliang; Xiong, Bifu; Xu, Fangyi; Chen, Biyang; Cui, Yinhua; Hu, Chuan; Yue, Gao*; Shen, Yu-An*, “Low-Temperature Transient Liquid Phase Bonding Technology via CuPorous-Sn58Bi Solid–Liquid System under Formic Acid Atmosphere”，Materials, 2023(SCI, IF3.4)
6. Siliang He*, Yuhao Bi, Yu-An Shen, Zhikuan Chen, Gao Yue*, Chuan Hu, and Hiroshi Nishikawa. Contact Angle Analysis and Intermetallic Compounds Formation Between Solders and Substrates under Formic acid Atmosphere. Journal of Advanced Joining Process. （2022）, 6, 100118. （ESCI, IF4.1）
7. Peijie Liang, Zhiliang Pan, Liang Tang, Guoqi Zhang, Daoguo Yang, Siliang He*, and Haidong Yan*. Molecular Dynamics Simulation of Sintering Densification of Multi-Scale Silver Layer. Materials.2022, 15, 2232. （SCI, IF3.748）
8. Siliang He, Jian Jiang, Yu-An Shen, Lanqing Mo, Yuhao Bi, Junke Wu, Chan Guo*, “Improvement of Solder Joint Shear Strength under Formic Acid Atmosphere at A Low Temperature”, Materials, 2024(SCI, IF3.4)
9. Minghui Yun, Daoguo Yang*, Siliang He*, Miao Cai, Jing Xiao, Kailin Zhang and Guo- Qi Zhang. Failure Quantitative Assessment Approach to MOSFET Power Device by Detecting Parasitic Parameters. Frontiers in Physics. 2022. (SCI, IF3.778)
其他发表论文
1. He, S.*, Gao, R., Shen, Y-A., Li, J. and Nishikawa., H. “Wettability, Interfacial reactions, and Impact Strength of Sn-3.0Ag-0.5Cu Solder/ENIG Substrate Used for Fluxless Soldering under Formic Acid Atmosphere”,Journal of Materials Science, vol. 57 No. 7, pp. 3107-3117, 2020(SCI, IF4.6)
2. He, S.*, Gao, R., Li, J., Shen, Y-A. and Nishikawa, H., “In-situ observation of fluxless soldering of Sn-3.0Ag-0.5Cu/Cu under a formic acid atmosphere”,Materials chemistry and Physics, vol. 239, pp. 122309, 2020(SCI, IF4.6)
3. Gong, Y., Liu, L., He, S., Yan, H., Li, W.*, Qin, H.* Shear performance of Cu/Sn–3.0Ag–0.5Cu/Cu joints with same solder volume and different heights at increasing current density. J Mater Sci: Mater Electron (2022). Online. (SCI, IF2.779)
4. Xinmin Li, Jian Wang, Hongbo Qin, Siliang He, Wangyun Li*, and Song Wei*. Creep performance of phase-inhomogeneous Cu/Sn–58Bi/Cu solder joints with increasing current density. Journal of Materials Science: Materials in Electronics 33, 16167–16182 (2022) (SCI, IF2.779)
5. Juncai Hou*; Qiumei Zhang; Siliang He; Jingru Bian; Jinting Jiu; Chengxin Li; Hiroshi Nishikawa., Large-area and low-cost Cu-Cu bonding with cold-spray-deposition, oxidation and reduction processes under low-temperature conditions. Journal of Materials Science: Materials in Electronics 32 (2021), pp.20461–20473 （SCI, IF2.779）
6. Duy Le Han*, Yu-An Shen, Siliang He, Hiroshi Nishikawa., Effect of Cu addition on the microstructure and mechanical properties of In–Sn-based low-temperature alloy. Materials Science and Engineering: A 804 (2021), pp.140785（SCI, IF6.004）
7. Fupeng Huo*, Yu-An Shen, Siliang He, Keke Zhang, Hiroshi Nishikawa., Fabrication of NiO/ZrO2 nanocomposites using ball milling-pyrolysis method. Vacuum 191 (2021), pp.110370（SCI, IF4.110）
8. Gao, R.*, He, S., Li, J., Shen, Y-A. and Nishikawa, H., Interfacial transformation of preoxidized Cu microparticles in a formic-acid atmosphere for pressureless Cu–Cu bonding. Journal of Materials Science: Materials in Electronics 31 (2020), pp.14635–14644. （SCI, IF2.779）
9. Gao, R.*, Shen, Y-A., Li, J., He, S. and Nishikawa, H., Interfacial transformation of preoxidized Cu microparticles in a formic-acid atmosphere for pressureless Cu–Cu bonding. Journal of Materials Science: Materials in Electronics 31 (2020),pp.21711-21722（SCI, IF2.779）
10. Zhou, S.*, He, S. and Nishikawa, H., Effect of Zn addition on interfacial reactions and mechanical properties between eutectic Sn58Bi solder and ENIG substrate. Journal of Nanoscience and Nanotechnology, 20 (1), (2020), pp.106-112. （SCI）
11. Jin, Z.*, Shen, Y-A., He, S., Zhou, S., Chan, Y, C. and Nishikawa, H. Novel Polarity Effect on Intermetallic Compound Thickness Changes during Electromigration in Cu/Sn- 3.0Ag - 0.5Cu/Cu Solder Joints. Journal of Applied Physics 126, (2019), 185109. （SCI, IF2.877）
12. Shen, Y-A.*, Lin, C.M., Li, J., He, S. and Nishikawa, H., 2019. Effect of FeCoNiCrCu 0.5 High-entropy-alloy Substrate on Sn Grain Size in Sn-3.0 Ag-0.5 Cu Solder. Scientific Reports 9(1) (2019), pp.3658. （SCI, IF4.996）
13. Gao, R.*, He, S., Shen, Y-A and Nishikawa, H., Effect of Substrates on Fracture Mechanism and Process Optimization of Oxidation–Reduction Bonding with Copper Microparticles. Journal of Electronic Materials 48(4) (2019), pp.2263-2271. （SCI, IF2.047）
14. He, S. and Nishikawa, H.*, Effect of Thermal Aging on the Impact Strength of Soldered Bumps under Formic acid Atmosphere. Quarterly Journal of The Japan Welding Society 35 (2017), pp.127-131. （EI）
15. Liu, X.*, He, S. and Nishikawa, H., Low temperature solid-state bonding using Sn-coated Cu particles for high temperature die attach. Journal of Alloys and Compounds 695 (2017), pp.2165-2172. （SCI, IF 6.371）
16. Liu, X.*, He, S. and Nishikawa, H., Thermally stable Cu3Sn/Cu composite joint for high-temperature power device. Scripta Materialia, 110, (2016), pp.101-104. （SCI, IF 6.302）
部分会议论文
1. Guoping Lv, Haidong Yan*, Siliang He* et al. Bonding Process of Copper Foam-Silver Composite and Performance Characterization of the Joint. In The International Conference on Electronic Packaging Technology (ICEPT), 2022（EI）
2. Bifu Xiong, Huixiu Lu, Yuhao Bi, Jiaqiang Huang and Siliang He*. Shear strength of joint formed using Sn-58Bi/Cu porous structure via TLP bonding. In 2022 The 2nd International Conference on Mechanical Engineering, Intelligent Manufacturing and Automation Technology (MEMAT 2022), 2022（EI）
3. Bi Yuhao, He Siliang*, Li Wangyun*, Shen Yu-An, Daoguo Yang and Hiroshi Nishikawa. Wettability improvement of solder in fluxless soldering under formic acid atmosphere. In The International Conference on Electronic Packaging Technology (ICEPT), 2021（EI）
4. He, S., Gao, R., Li, J. and Nishikawa, H.*, Sn steaming phenomenon under formic acid atmosphere. In The 5th International Symposium on Visualization in Joining & Welding Science through Advanced Measurements and Simulation (Visual-JW2019), 2019
5. He, S.* and Nishikawa, H., Effect of substrate metallization on the impact strength of Sn-Ag-Cu solder bumps fabricated in a formic acid atmosphere. In International Conference on Electronic Packaging (ICEP), 2017 (pp. 381-385). IEEE. （EI）
6. Zhang, Y.*, He, S. and Nishikawa, H. Impact strength of Sn-Ag-Cu/Cu solder bumps formed by an induction heating method. In 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2017 (pp. 50-53). IEEE. （EI）
7. Nishikawa, H.*, Liu, X. and He, S. Effect of bonding conditions on shear strength of joints at 200° C using Sn-coated Cu particle. In 2017 21st European Microelectronics and Packaging Conference (EMPC), 2017 (pp. 1-4). IEEE. （EI）
8. He, S. and Nishikawa, H.*, Effect of Thermal Aging on the Impact Strength of Soldered Bumps under formic acid atmosphere. In The international Symposium on visualization in Joining & Welding Science through Advanced Measurements and Simulation (Visual-JW2016), 2016 (pp. 27-28).
9. Liu, X.*, He, S. and Nishikawa, H. Low temperature bonding using microscale Cu particles coated with thin Sn layers at 200° C. In International Conference on Electronic Packaging (ICEP), 2016 (pp. 306-309). IEEE. （EI）
10. He, S.* and Nishikawa, H., Formation of Solder Bumps on Electroless Ni/Au Plating Using Formic Acid Atmosphere．Proceeding of Micro-joining and Assembly Technology in Electronics Symposium, 2017. (pp. 264-267)
11. 何 思亮， 西川 宏, ギ酸雰囲気を用いた無電解Ni/Auめっき上へのはんだバンプ形成 . 第23回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集, 77-78
12. 何 思亮， 西川 宏, リフローはんだ付におけるフラックスとギ酸雰囲気の比較. マイクロエレクトロニクスシンポジウム論文集 第 26 回マイクロエレクトロニクスシンポジウム, 107-110
13. 何 思亮， 西川 宏, ギ酸雰囲気を用いたはんだ付でのボイド形成に及ぼす加熱条件の影響. 溶接学会全国大会講演概要 平成 28 年度春季全国大会, 158-159
14. 何 思亮， 西川 宏, 菊池 大地， 上島 稔, はんだ濡れ性および界面反応におけるギ酸雰囲気の影響. 溶接学会全国大会講演概要 平成 27 年度秋季全国大会, 418-419
